Call for Papers: IEEE International Conference 2026 on Emerging Technologies

The Punjab Engineering College (Deemed to be University), Chandigarh, is hosting the 2026 IEEE Chandigarh Subsection International Conference (CHANDICON 2026).

IEEE CHANDICON is a flagship annual event organized by the IEEE India Council and IEEE Delhi Section, under the guidance of the IEEE Chandigarh Subsection.

The theme is Emerging Technologies Shaping Tomorrow. Researchers, Industry experts, and Scholars are invited to submit papers for this prestigious conference.

The Conference will be held from August 20–22, 2026, in the vibrant city of Chandigarh.

The conference aims to provide a platform where participants can:

  • Share innovative research findings
  • Exchange knowledge and expertise
  • Network with global professionals
  • Explore emerging technological trends
ConferenceIEEE Chandigarh Subsection International Conference (CHANDICON 2026)
ThemeEmerging Technologies Shaping Tomorrow
VenuePunjab Engineering College, Sector-12, Chandigarh
DatesAugust 20–22, 2026

Accepted and presented papers will be submitted to IEEE Xplore.

Explore more Call for Papers

Important Dates

EventDate
Call for Papers BeginsJanuary 10, 2026
Paper Submission DeadlineMay 15, 2026
Acceptance NotificationJune 15, 2026
Camera-Ready SubmissionJune 30, 2026
Early Bird Registration DeadlineJune 30, 2026
Final Registration DeadlineJuly 10, 2026
Conference DatesAugust 20–22, 2026

Technical Tracks

CHANDICON 2026 covers a wide range of research domains, including:

  • Power Systems, Monitoring & Control
  • Power Electronics & Drives
  • Renewable Energy Systems
  • Smart Grids & Energy Analytics
  • Artificial Intelligence & Data Science
  • Computer Networks & IoT
  • Next-Generation Computing
  • Cybersecurity & Privacy
  • Communication & Signal Processing
  • RF, Microwave & Terahertz Technologies
  • Semiconductor Devices
  • VLSI & Embedded Systems
  • Nanotechnology & Advanced Materials
  • Quantum Technologies

Paper Submission

Researchers can access conference details and submit their papers through the following links:

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